According to financial news on July 16, 2024, Tianyancha intellectual property information shows that Hebei Zhongci Electronic Technology Co., Ltd. applied for a project called "A filler and barrel plating method for barrel plating ceramic packaging casings" , Publication number CN202410483949.5, application date is April 2024.
The patent abstract shows that the present invention provides a filler and a barrel plating method for barrel plating ceramic packaging casings, and belongs to the technical field of barrel plating of ceramic packaging casings. The filler is used for barrel plating after being mixed with the ceramic packaging shell. The inner and outer plating areas of the ceramic packaging shell are not connected to each other. In the present invention, by setting the length of the cylindrical first filler to be greater than twice the depth of the opening of the ceramic package shell, the plating area inside the opening can be directly contacted with the cathode through the first filler during barrel plating, and at the same time, the two ceramic packages The plating area in the mouth of the shell opening can be directly connected, and then directly contacted with the cathode to achieve electroplating. In addition, the diameter of the first filler is set to be smaller than the maximum inscribed circle diameter of the opening and larger than the distance between the electroplating area and the adjacent cavity side wall to prevent the first filler from getting stuck in the gap between the opening and the edge of the electroplating area, thus achieving Barrel-plated ceramic package with complex structure.
Source: Financial Industry
